Manufacturing and Engineering

Focus on the “Power of Innovation” — with Keynotes from AIST, GlobalFoundries, and Soitec at SEMICON Japan 2013

TOKYO, Japan — November 6, 2013 — Today, SEMI announced an exceptional lineup of keynotes speakers for SEMICON Japan 2013 including: Ryoji Chubachi, AIST; Ajit Manocha, GLOBALFOUNDRIES; and Paul Boudre, Soitec.  SEMICON Japan 2013, one of the largest exhibitions in the world for semiconductor manufacturing and related processing technology, will take place at Makuhari Messe in Chiba on December 4-6. Registration is open for both the exhibition and programs on the SEMICON Japan 2013 website at In addition, the 32nd annual SEMI Technology Symposium (STS) provides an international forum for device manufacturers and equipment and materials suppliers to discuss the challenges and perspectives of the industry’s technology trends.

Restructuring and consolidation has led to a new focus for the semiconductor manufacturers in Japan. As a result, the semiconductor equipment market in Japan will experience  growth in and 2014, driven by higher spending for memory production and in spending increases planned for the manufacturing of power semiconductors and “More than Moore” semiconductor technologies. Total equipment spending in Japan is estimated to reach $4.0 billion by 2014.  Combining this with the $8 billion spending on semiconductor materials, Japan represents about a $12 billion market in 2014 for the suppliers of equipment and materials.

Leading the investment activity in Japan is Flash Alliance, the joint-venture between Toshiba and Sandisk.  According to the SEMI World Fab Forecast database, equipment spending for Flash Alliance could approach between $1.8 billion to $2.3 billion this calendar year and even more in 2014 because of the overall strong market demand for NAND flash in mobile products.  Toshiba announced plans to spend up to $300 million (30B yen) to construct the Fab 5 phase 2 at the Yokkaichi plant location. This new fab will ramp for production of sub-20 nm/3D flash memories, with building construction completed by about mid 2014.

In addition, a number of other Japanese semiconductor companies are very active and are aiming to grow their share in the power semiconductor device market. More information will be available at SEMICON Japan, but key investment-related activities involve: Fuji Electric, Toshiba, Mitsubishi Electric, Panasonic, and Hitachi.  While the semiconductor industry and device makers have experienced a period of retrenchment and consolidation, new investments for this year and next point to a rebound in equipment spending in Japan.

SEMICON Japan 2013 will offer the opportunity to explore key technologies and business models necessary to grow in the coming years. On December 4, SEMICON Japan 2013 will start with the Opening Keynotes featuring three global executives to speak about industry growth into the future. Ryoji Chubachi, president at National Institute of Advanced Industrial Science and Technologies, believes that the total strength of entire semiconductor supply chain from materials and equipment to device still exists in Japan and facilitating open innovations will lead Japan to resume the position in the global semiconductor industry.  Ajit Manocha, CEO at GLOBALFOUNDRIES, will examine the evolution and future of the foundry model, the technical and business drivers reshaping the landscape, and how fabless and IDM companies must change their perspective on what has worked in the past, regardless of how you define “leading edge.”  Paul Boudre, CEO at Soitec, will illustrate how engineered substrates technologies can bring innovation by pushing “Moore’s law” and “More than Moore” further in the mobile era where the electronic industry is driven by the “always connected” trend and insatiable user demand. The opening ceremony and opening keynotes are no charge for SEMICON Japan 2013 exposition attendees, but pre-registration is required.

Special programs at SEMICON Japan include: on December 5, a 450mm Transition Update Forum with speakers from G450C, imec, Nikon, and Tokyo Electron; on December 4, an EHS Standards Workshop “Challenges for 450mm” and a 450 Manufacturing EHS and Facilities Seminar; and on December 6, “Notchless System: 450 Standard Considered.” In addition, on December 5-6, numerous programs on 3D-IC include: 3D-IC Summit “Key to a Quantum Leap,” OSAT Executive Forum, TA&P Night plus three programs on TechSTAGEs.

Leading-edge semiconductor manufacturing technologies will be exhibited on the SEMICON Japan show floor in three zones: Front-end Process and Back-end/Materials & Overall Process. In addition, the floor will feature focused pavilions on:

  • Advanced Electronics Technology
  • Chemical Materials Management
  • Micro Fabrication & Fine Process Technology
  • Advanced Manufacturing Technology
  • Supply Chain
  • Secondary Equipment and Service
  • Venture

Special TechSTAGE Premier offer programs on STS Satellite 1 (Technology Meets Art) and Satellites 2 and 3 (Microsystems/MEMS); Power Semiconductors; STS Satellite 4 (Packaging) and  satellite 5 (DFM); Nanoimprint Technology Study Symposium; Printed Electronics Association Symposium; and Silicon Saxony Technical Symposium. TechSTAGE West offers a Semiconductor Used Equipment Business Seminar; Proposals to the Assembly Technologies to Drive 3D-IC; SEMI EHS and Sustainability Update; and also product and technology release presentations and exhibitor presentations.

Before the opening keynotes, the SEMICON Japan Opening Ceremony will be held at 9:30am. Keynotes feature addresses from AIST, GLOBALFOUNDRIES, and Soitec. In addition, SEMICON Japan 2013 includes various social networking events: SEMI Presidents Reception, SEMI Standards Friendship Reception, TA&P Night, and Happy Hour.

SEMI anticipates an increase in capital investment next year in Japan.  2014 will be a year of growth,” said Hank Nakagawa, president of SEMI Japan, “This event is an exceptional opportunity to learn about everything happening in the industry in only three days… from 450mm to 3D-IC to printed electronics to power semiconductors.”

Japanese-English simultaneous translation will be available for many of the events and sessions at SEMICON Japan.

SEMICON Japan 2013 is the place for information exchange and networking opportunities for people interested in semiconductor-related businesses in Asia — through the opening keynotes, pavilion and exchange networking events. SEMICON Japan 2013 also provides exhibitors an excellent opportunity to meet major device companies, TOSHIBA, Panasonic and Texas Instruments Japan, through the Suppliers Search Program. The Happy Hour of the Suppliers Search Program is open to visitors.

Please visit for more information.

Sponsors of SEMICON Japan include Advantest, Tokyo Electron, Applied Materials, ASE Group, Canon, EBARA, JSR Corporation, Nikon, and Screen.

About SEMI

SEMI is the global industry association serving the nano- and micro-electronic manufacturing supply chains. Our 1,900 member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit

Association Contacts

Deborah Geiger/SEMI
Tel: 1.408.943.7988

Expositions and Programs/SEMI Japan
Tel: 81.3.3222.6020

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Original Source: …and Soitec at SEMICON Japan 2013